It’s made from durable FR-4 glass-reinforced epoxy, which is the same strong, flame-retardant material used in professional-grade, mass-produced circuit boards. The holes are pre-tinned, making soldering components easy and reliable.
Key Features
- Standard 2.54mm Pitch: The holes are spaced 2.54mm (0.1 inches) apart, which is the standard size for all DIP components, headers, and ICs.
- Plated-Through Holes (PTH): Every hole is tinned and electrically connects the top and bottom layers, making soldering simple and creating very strong joints.
- Durable FR-4 Material: Made from high-quality, sturdy glass fibre, this board won’t warp or break easily and can withstand soldering heat.
- Mounting Holes: Includes four mounting holes in the corners, making it easy to secure your project inside an enclosure.
Technical Specifications
| Feature | Specification |
| Dimensions | 4cm x 6cm |
| Hole Pitch | 2.54mm (0.1 inch) |
| Hole Diameter | Approx. 1.0mm |
| Material | FR-4 Glass Fibre |
| Layers | 2 (Double-Sided) |
| Board Thickness | 1.6mm |













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